Standardized contact reduce machine change over time

Most RFID tags in the market nowadays are made by "flip-chip bonding" process to bond the IC to the antenna. However, we are taking a different approach. We are using "strap bonding". The capacity of our strap bonding process remains unchanged even when we put different ICs or antenna designs to production. No re-calibration or tooling is required when we change over for different production batches. With larger contact areas for bonding electric conductivity and physical binding strength, the end result is more durable and effective products.